本书介绍了学习EDA所需的内容，从而揭开了这个高技术产业的神秘面纱。书中以友好、非正式的方式介绍EDA商业和技术，其内容对非专业读者足够清晰，对专业读者足够详细。本书面向EDA、半导体或相关产业中负责销售、市场、公关、法规、金融等的非技术人员，同时也可以作为VLSI设计中的交叉学科工程、商业和市场课程的**补充教材。
在本书中，经验丰富的产业***Mark Birnbaum简单而清晰地介绍了EDA要解决的设计问题、解决问题的工具、应用工具的设计者以及使得EDA成为电子产品和芯片设计关键的因素。另外，本书提供了供新入行者参考的丰富的附录，包括电子、半导体制造、计算和通用计量方面的入门资料、参考资源和完整的缩略语术语表。
本书的主要特点
●解释EDA是如何适合电子产品和半导体产业的。
●从工具使用者和EDA软件***的角度研究EDA产业，包括商业模型、****和工具评
价。
●包括定义IC作用的电子系统级工具、设计IC行为的前端功能性芯片级工具、实现IC物理布
局的后端设计工具。
●讨论EDA产业的趋势和IC设计问题，包括深亚微米的挑战、知识产权和片上系统。
●包括ED

Preface iii
Chapter 1 Introduction to EDA.
Introduction.
Electronic Products.
Printed Circuit (PC) Boards.
Integrated Circuits.
CAD, CAM, CAE, and EDA.
Data, Signals, and Input/Output.
Electronic Product Development.
EDA Party—Users and Tools.
System Design.
Logic Design.
ASIC Design.
Physical Layout Design.
EDA Benefits.
Summary.
Chapter 2 The Business of EDA.
Introduction.
EDA User Return on Investment.
EDA Vendor Return On Investment.
EDA Tool Development Sources.
In-house/Out-source EDA Tool Development.
The Time-to-Market Competition.
EDA Business Models.
New EDA Tools.
Licensing Models.
Mergers and Acquisitions.
Application Service Provider Model.
Design Services Business.
EDA Industry Growth.
Relative Industry Sizes: EDA, IC, Electronics.
Relative Risk Factor.
EDA People and Conferences.
People Opportunities.
Key Conferences.
Summary.
Quick Quiz.
Chapter 3 The User Perspective.
Chapter 4 Overview of EDA Tools and Design Concepts.
Chapter 5 Electronic System-Level Design Tools.
Chapter 6 Front-end Design Tools.
Chapter 7 Back-end Design Tools (Physical Design).
Chapter 8 Trends.
Appendix A: Elementary Electricity.
Appendix B: Semiconductor Manufacturing.
Appendix C: Signals to Software.
Appendix D: Metrics.
Appendix E: References.
Appendix F: ICs, IP, and SoC.
Appendix G: Glossary-Terms and Acronyms.
Index.